ETON SMT placemant machine With 90000CPH for led DOB making chip
mounter
Machine introduction
HT-E8D is a dual system,dual module multifunctional mounter to
produce two different products at the same time,it can mount the
component range from 0402 to 15mm.and e8d has two guide rail, and
each rail can produce a product,and the one side is wrong,the other
side will continue.E8D-1200 is suitable for the largest PCB board
size of 1200 * 300mm,mini size 100*100mm.with a production capacity
of 90000 CPH. for the E8 series model,we can provide customized
service ,according to your size of your PCB size make the proper
machine for your products. in order to service our customers
better.
HT-E8D of Technical Parameter
| Dimension | 3150*2250*1650mm |
| PCB Size | Max: 1200*300mm Min: 100*100mm |
| PCB Thickness | 0.5~5mm |
| Mounting mode | Group picking and separately placing,separately picking and
separately placing |
| Mounting precision | ±0.04mm |
| Mounting height | <15mm (Automatic changing) |
| Mounting speed | 90000 CPH |
| No.of camera | 4 sets Vision for the flight identification, Mark correction |
| Components space | 0.2mm |
| No.of feeders station | 48 PCS |
| No.of head | 24 PCS |
SMT Line
The surface mount assembly process mainly includes the following
steps: solder paste printing, component mount, and reflow
soldering. The steps are summarized as follows:
Stencil Printing: solder paste is a follow-up material for the
surface adhesive components and PCB to connect with each other.
First, the steel plate is etched or laser cut, and then the solder
paste is printed on the welding pad of PCB by the squeegee of the
Printing machine, so as to enter the next step.
Component Placement: Component Placement is the key technology and
work focus of the entire SMT process. The process USES highly
precise automatic mounting equipment to accurately place the
surface mount components on the solder pad of the printed PCB
through computer programming.As the design of surface adhesive
components is becoming more and more precise, the distance between
the joints is becoming smaller, so the technical level difficulty
of placement operation is increasing day by day.
Reflow Soldering,(Reflow Soldering) : Reflow Soldering is to have
been placed on the surface of adhesive components of the PCB, after
Reflow furnace first preheating with activated flux, to raise its
temperature to 217 ℃ melt solder paste, feet and PCB Soldering pad
connected components, then after cooling, cooling, make the solder
curing, surface adhesive components and PCB bonding is completed.
Own manufacturing Center, Control quality from original
1: 52000 SQM manufacturing center
2: Machine main parts are made by own, high standard products
quality
3: Strict QC department ensure high quality
4: Big production quantity, delivery on time
Shipping and Delivery
Land transportation: suitable for inland countries and it is affordable;
Air freight: for urgent good, and it is the most expensive transportation way;
Shipping: It’s suitable for heavy goods, and the convenience and lower cost
of shipping which is easy for clients to accept the arrival time of
the goods.
Exhibition
ETON has participated in many exhibitions of foreign countries ,
such as India Mumbai Exhibition, India Delhi Exhibition, Egypt
Exhibition, Turkey Exhibition, Pakistan Exhibition, etc and trading
with more than 20 countries. Furthermore, we have took part in our
domestic large exhibition, like Guangzhou Guangya Exhibition,
Shanghai Munich Exhibition, Chongqing LED light Exhibition, etc.
FAQ
Q: Do you have a product certification certificate?
A: Our products have CCC, CE, SRIA certification.
Q: What is your payment terms?
A:100% payment before delivery or 50% deposit in advance and the
rest before shipment.
Contact David
Whatsapp/Wechat/Tel: +86 13827425982
E-mail: david@eton-mounter.com
